ntcc200e4, ntcc300e4 www.vishay.com vishay bccomponents revision: 20-mar-17 1 document number: 29153 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 leadless ntc thermistor die suitable for wire bonding features ? flat chip contacted top and bottom ? (gold: ntcc300e4 series or silver: ntcc200e4 series) ? green thermistor - does not use rohs exemptions ? wide temperature range from -55 c to +175 c ? highly resistant to thermal shocks ? ideal for wire bond ing (aluminum or gold depending on meta lization type) ? resistance to leaching ? delivered on blister tape ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? high temperature sensing, control and compensation. ? e.g. igbt modules (inverters in ev and hev vehicles) ? ic and semiconductor protecting ? dc/ac power inverters an d hic overheat protecting design-in support for complete curve computation, please visit: ? www.vishay.com/thermi stors/ntc-curve-list/ marking the thermistors have no ma rking and have electrode termination design without orientation. mounting the thermistors are primarily in tended for wire bonding. the parameters of the assembly pro cess should be chosen in accordance with the lead-wire material. ? the mounting process should be in compliance with the following guidelines and recommendations: die bonding: ? gold electrode: silver epoxy gluing. ? silver electrode: (vacuum) reflow soldering - silver epoxy gluing - nano silver sintering. cleaning: ? detergent spraying. ? ultrasonic or formic acid vapor cleaning is not recommended. wire bonding: ? the gold electrode has been tested for gold wire bonding with a wire diameter of max. 32 m. ? the silver electrode has been tested for aluminum wire bonding with a wire diameter of max. 300 m. encapsulation: ? in order to preserve the charac teristics of the bonded die at long term an encapsulation is mandatory . ? the encapsulation is defined by the user. silicon and epoxy encapsulations ha ve been tested. for recommendations on compatible encapsulants contact vishay. note (1) in order to define r 25 -tolerance, replace * in sap pa rt number by f ( 1 %), g ( 2 %), h ( 3 %), or j ( 5 %) quick reference data parameter value unit resistance value at 25 c 4.7k to 20k ? tolerance on r 25 -value 1; 2; 3; 5 % b 25/85 -value 3435 to 3865 k tolerance on b 25/85 -value 1 % operating temperature range -55 to +175 c response time (63.2 %) 25 c to 85 c still air (for info) 3s dissipation factor ? in still air ? (for info, non-mounted die) 3mw maximum power dissipation 50 mw weight 3 mg electrical data and ordering information r 25 ( ? ) r 25 -tol. ( %) b 25/85 (k) b 25/85 -tol. ( %) description sap material and ordering number (1) 4700 1, 2, 3, 5 3435 1 bare die with top / bottom silver term inations ntcc200e4472*t 12 000 1, 2, 3, 5 3740 1 bare die with to p / bottom silver te rminations ntcc200e4123*t 20 000 1, 2, 3, 5 3865 1 bare die with to p / bottom silver te rminations ntcc200e4203*t 4700 1, 2, 3, 5 3435 1 bare die with top / bottom gold terminations ntcc300e4472*t 12 000 1, 2, 3, 5 3740 1 bare die with to p / bottom gold terminations ntcc300e4123*t 20 000 1, 2, 3, 5 3865 1 bare die with to p / bottom gold terminations ntcc300e4203*t
ntcc200e4, ntcc300e4 www.vishay.com vishay bccomponents revision: 20-mar-17 2 document number: 29153 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? non-dimensioned details do not affect the performance of the thermistors dimensions in millimeters parameter value w2 0.1 t 0.7 max. packaging the components are delivered on 8mm embo ssed blister tape (0.3 mm conductive ps) conforming to eia-481 and iec 60286-3, ? with 2000 parts per reel. parameter value a 0 2.2 0.1 b 0 2.2 0.1 k 0 1.0 0.1 w8 0.3 f 3.5 0.05 e 1 1.75 0.1 p 0 4.0 0.1 p 2 2.0 0.05 d 0 1.5 0.1 d 1 1.0 0.1 t 0.35 max. t 2 0.50 max. wt wire bondable s urface
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